DE GUZMAN, Jose Cesar; 						EPISTOLA, Elmer; 						MENA, Manolo G..
 Elimination of Assembly-Induces Package Cracks in Plastic Soic.
<strong>Philippine Engineering Journal</strong>, [S.l.], v. 18, n. 1, aug. 2021.
ISSN 2718-9287.
Available at: &lt;<a href="https://journals.upd.edu.ph/index.php/pej/article/view/8037" target="_new">https://journals.upd.edu.ph/index.php/pej/article/view/8037</a>&gt;. Date accessed: 16 sep. 2025.