Delamination in Plastic Packages

  • Manolo G. Mena College of Engineering, University of the Philippines Diliman

Abstract

Delamination of the disbanding of the plastic moulding compound from various surfaces and interfaces in a packaged integrated circuit is a major cause of reliability failures. This paper reviews the causes of the said disbonding, the types of reliability failures that may be induced as well as various solutions available to prevent delamination.

Published
2021-08-31
Section
Articles